Manual Wire Bonder
|Category:||Electronics Production Machinery|
|Keyword:||Esec Die Bonder , Cable Clamps , Hose Clamps , Copper Clamps , Pg Clamps , Chip Sorter , Wire Clamps , Wire Bonder , Die Bonder|
esec die bonder, Wholesale esec die bonder Product Details
Machines of this series bond aluminum or gold wires from 0.0007 in. to 0.002 in. diameter, gold ribbon 0.0005 in. by 0.002 in. through 0.001 in. by 0.010 in. by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is fed to the work point by two methods selectable by exchange of wire clamps; either diagonally through the heel of the bonding wedge, or vertically down through a hollow wedge. Either allows programmed motions to clamp, break, and feed wire continuously, but requires front-to-back bonding direction. This machine is very easy to use.
In the other hand, we have many kinds of machines: wire bonder, die bonder, mask aligner, ....
please visit our website: www,acrosemi.com or contact
Mr. Phuong Nguyen HP: 0903305673
Mr. Tuan Mai HP: 0912257173
Manual Wire Bond