Description:
1 PCB layer: 1~20 layers
2 PCB Material Highlights: FR4, CEM1, CEM3, FR2, FR1, XPC,IMS,FR-5, High Tg, Green Material.
3 Surface Finish Option: HASL, Anti-tarnish coating (OSP), Ni/Au (immersion gold), Ni/Au (soft gold), mixed, fre-flux white tin, carbon resistance
4 Max board size:
5 Single/Double-sided Pcb: 650x450mm; Multilayer PCB: 500x450mm;
6 Board thickncss 0.3mm-3.2mm
7 Min track width 0.10mm
8 Min.space 0.10mm
9 Min Diameter for PTH hole 0.1mm
10 Min Diameter for pad or via 0.6mm
11 PTH Hole Dia.Tolerance&le&Phi0.8±0.05mm &ge&Phi0.8 ±0.10mm
12 Hole Position Dcviation ±0.05mm
13 Flammability 94v-0
14 Solderability 235°C
15 board Twist &le0.01mm/mm
16 Computer files required: GERBER, POWERPCB, PROTEL, PADS2000, AUTOCAD, ORCAD etc.
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Jasper Electronics Co., Ltd.
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