Description:
Number of layers: Double-sided
Major material: FR-4, CEM-3 (other materials upon request)
Min. board thickness:
Double side: 0.2mm (7.8 mil)
Max. board thickness: 2.4mm (95 mil)
Surface finishing:
Flash gold plating
Immersion gold (max. 0.5 micrometer)
Thick gold plating (max. 1.0 micrometer)
Hot-air solder leveling
Entek coating (OSP)
Solder mask: LPI (wet film), thermal cured type
Other print:
Carbon print, peelable solder mask
Solder mask plugged hole
Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140 micrometer)
Min. hole size: 0.3mm (12 mil)
Hold size tolerance (NPTH): +/- 0.076mm (3 mil)
Min. line width and spacing: 0.1mm (4 mil)
Min. solder mask clearance: 0.076mm (3 mil)
Min. annular ring: 0.076mm (3 mil)
Profile and v-cut:
V-cut, jump v-cut, CNC v-cut
CNC-routing, stamping and beveling
Special process: Blind/buried via hole pcb board
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